(PresseBox) (Berlin, )Vehicles are becoming much more complex – innovative materials and intelligent wiring are required for newly developed vehicles like EVs and HEVs. Meet leading OEMs and suppliers at IQPC’s 2nd International Congress Intelligent Automotive Cables & Plugs 2012, 21 – 22 May 2012 in Darmstadt to discuss state-of-the-art technology and how to comply with latest international standards.
At the only international event on cable and plug solutions for future wire systems, presentations will center around following topics:
• Bordnet innovations
• Future wire systems
• OEM experiences with EV and HEV: Standards and specifications
• Cables and plugs for high voltage systems
• Innovative materials and technology, e.g. 3D-MID technology
A panel discussion on 21 May 2012 and frequent networking breaks ensure a productive exchange of information between OEMs and suppliers. Meet representatives of Toyota, Continental, ODU Automotive, Federal Mogul, VDE Testing and Certification and many more.
One key point of discussion will be for example whether aluminium, copper or other materials are best suited for future wiring. In addition, learn about the potential for reducing cost by automatizing the production process for wire harnesses.
To learn more about the conference and access interesting downloads, go to