The Road to Innovation: a Modular Future for Test, Munich November 13th to 16th, November 2007 Booth A1. 338

The Road to Innovation: a Modular Future for Test, Munich November 13th to 16th, November 2007 Booth A1. 338 (PresseBox) (Benediktbeuern, ) High fault coverage, speed, ease of use, flexibility, cost-effectiveness: these are just some of the demands made of today’s leading electronics test systems. It’s a tall order, but Test Expert Seica continues to lead the industry along the "road to innovation" with its modular "one platform, many solutions" strategy, which not only meets these needs, but does a whole lot more besides. Electronics manufacturers can find out just how on booth A1.338 where Seica will be showcasing all the very latest and best in its highly successful range of innovative solutions for electronics testing and selective soldering.

The first of these is the AERIAL M4 Flying Probe test system. With its innovative, vertical, compact architecture, this system introduces a new dimension in fixtureless test, both from the viewpoint of minimizing space requirements (very small footprint) and extremely fast and stable double-side probing, without any problems due to the natural oscillation of the UUT intrinsic to horizontal systems. Coming from years of experience in providing market-leading flying probe test systems, the Aerial series (comprised of two models, the Aerial M2 and Aerial M4) is based on Seica’s proprietary VIVA Integrated Platform (VIPÒ) which provides a full range of test techniques and automatic programming tools enabling the user to have a full coverage test program ready to run in a very short time, with a minimum effort and without requiring highly specialized personnel. This, along with a very interesting entry price, makes the Aerial an optimum test choice in terms of low cost of ownership and maximum productivity.

Visitors can also view Seica’s full-performance PILOT VIP Flying Probe system, which integrates a complete set of test tools and techniques that enable it to perform the entire range of in-circuit and functional tests, as well as providing additional capabilities such as AOI Inspection, Boundary-scan, On-board programming and a fully flexible and programmable SMEMA conveyor making it an easy fit into an automated line.

These, along with all other Seica systems run on the powerful VIP™ software platform, which optimizes test-program development time, test time and fault coverage while providing a common software architecture across all Seica products, supporting seamless migration between different test strategies and systems. This strategy has numerous advantages for the user, not least of which is the elimination of the need to re-train test technicians, who continue to operate in the same software environment, where program development is guided in a simple 3-step process; a series of automated operations literally "do the work" necessary to get test programs up and running quickly in an intuitive, self-explanatory environment.

Another highlight in this year’s booth is aimed at those manufacturers interested in functional test. Seica has developed a series of turn-key solutions based on the Strategy line of test systems; the solution on view is specifically addressed to automotive electronics testing, with a "live" example of a true automotive test application.

The latest addition to Seica’s growing portfolio, the Firefly concentrates all the power and precision of laser technology into the automated selective soldering process. Firefly integrates Seica’s easy to use VIP™ software, which includes a completely new automatic program development environment that drastically reduces the time needed to setup soldering programs. Equipped with a SMEMA compatible board conveyor system and fiducial recognition, Firefly is easily integrated into a fully automated production line, and sophisticated algorithms and fast loop control enable automatic management of pcb characteristics and environmental factors, resulting in a high level of soldering quality and repeatiability. Thermal control, so essential to the soldering process, is guaranteed by an integrated temperature control system that provides continuous feedback during the soldering process and displays thermal profiles clearly in real time, then stores the profiles and images of each soldered point, ensuring complete traceability of the soldering process.

Kontakt

Seica Deutschland
Am Postanger 18
D-83671 Benediktbeuern
Renate Fritz
RF Communications

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