Jenoptik is one on the finalists for the "Best of West" award of SEMI, the global semiconductor industry association
(PresseBox) (Jena, )The JENOPTIK-VOTANTM G Semi laser system for thermal laser beam separation, in particular of wafers (wafer dicing), is one of the eight innovations which the SEMI industry association expects to have significant impact on the development of the semiconductor and related industries. The award will be presented by the global SEMI association during Semicon West in San Francisco on July 16, 2008.
In the field of laser materials processing Jenoptik has progressed the so-called thermal laser beam separation process with its JENOPTIK-VOTANTM G Semi laser system up to the mass-production ready stage. Brittle materials such as glass, ceramics and semiconductors are heated via a laser beam and then quickly cooled. The powerful stresses that occur in the material as a result create a defined crack along the laser beam's direction of movement. In comparison with conventional, abrasive technologies the impressive features of the new process are the micro-crack free edges it produces and the fact that it simultaneously prevents contamination. It is a contactless process and because of the special active principle operates totally particle-free. In addition, with the thermal laser beam separation the process speed is increased by up to 300 percent.
According to SEMI, with its nomination for the "Best of West" award the novel technique of Jenoptik Automatisierungstechnik GmbH ranks among the eight most important product and process innovations in the value added chain of the global semiconductor industry. Selection criteria of the industry association are the expected impact on the industry, the importance of the innovation and/or the societal impact. SEMI (Semiconductor Equipment and Materials International) is a global industry association of leading semiconductor manufacturers and related industries, e.g. the flat panel industry. Jenoptik will present the JENOPTIK-VOTANTM G Semi laser system, developed in particular for wafer dicing, for the first time at Semicon West in San Francisco from July 15 to 17.