X-FAB and Micronas join in strategic partnership

Collaboration as foundry and technology partners for the 0.18 µm high-voltage CMOS process with embedded flash results in Micronas acquiring a stake in X-FAB
(PresseBox) (Erfurt (Germany) and Zurich (Switzerland), ) X-FAB Silicon Foundries Group and Micronas (SIX Swiss Exchange: MASN) announced today that they are joining in a cooperative and strategic partnership. As foundry partner, X-FAB will provide the next technology generation, the 0.18 µm high-voltage CMOS process with embedded flash, and will also manufacture the related products. Micronas will support X-FAB as technology partner and has the option to manufacture the products in its own wafer fab in the future. Micronas also is acquiring a EUR 10 million stake in the X-FAB Group.

Through their collaboration, Micronas as a leading supplier of cutting-edge and application-focused sensor and IC system solutions for automotive electronics, and the X-FAB Group as the world's leading foundry group for analog/mixed-signal semiconductor applications, can mutually exploit their many years of experience in the automotive sector, thereby enhancing their existing technological opportunities and production capacities.

"X-FAB combines high-voltage and embedded flash in one process - which is unique for 0.18 µm in the foundry sector," says Hans-Jürgen Straub, CEO of X-FAB. "Our technological expertise, the product experience of Micronas and X-FAB's manufacturing experience garnered over many years in the automobile industry provide the ideal foundation for the long-term expansion of both our market positions in this segment."

"With this cooperation, Micronas is securing early access to future manufacturing technologies," says Matthias Bopp, CEO of Micronas. "In X-FAB we have found the perfect partner to provide Micronas with the best possible support for the 0.18 µm high-voltage CMOS process with embedded flash."

About X-Fab

X-FAB is the leading analog/mixed-signal foundry group manufacturing silicon wafers for analog-digital integrated circuits (mixed-signal ICs). X-FAB maintains wafer production facilities in Erfurt and Dresden (Germany); Lubbock, Texas (US); and Kuching, Sarawak (Malaysia); and employs approximately 2,400 people worldwide. Wafers are manufactured based on advanced modular CMOS and BiCMOS processes with technologies ranging from 1.0 to 0.13 micrometers, for applications primarily in the automotive, communications, consumer and industrial sectors. For more information, please visit www.xfab.com.


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