Kontron defines new Computer-on-Module standard creating low-power, scalable, out-of-the-box solutions

ADLINK supports new Kontron module standard for ARM and SOC processors right from the start
(PresseBox) (Eching, Germany, ) Today, at SPS/IPC/Drives 2011 in Nuremberg, Kontron announced its newly defined Computer-on-Module (COM) standard for their upcoming ultra low-power embedded architecture platform family. Releasing its new COM standard marks a significant milestone in Kontron's recently announced strategic entry into the ARM market.

The new COM standard features a slim form factor designed for the company's future ultra low-power, off-the-shelf platforms, including: embedded handheld devices and rugged tablets, as well as, box PCs and HMI systems. By extending the COM usage model to RISC architectures with scalable, modular and out-of-the-box solutions, Kontron's new module standard bridges the gap between current proprietary industrial offerings and offerings from the consumer market - a far less suitable solution for demanding environments. Seeing the value in Kontron's innovative way of implementing ARM and SOC processors on a module, ADLINK has committed to support the new standard. This enables OEMs and system integrators to have a second source for Kontron's newly defined COM.

The standard at a glance The new COM standard was developed to encompass a new range of modules for ARM and SOC processors. Based on the 314-pin MXM 3.0 connector that is only 4.3mm in height, it enables durable and slim designs with a cost-efficient horizontal card edge / goldfinger connection. The connector is also available in a shock and vibration proof construction suitable for harsh environments. The standard enables new interfaces specifically for the new ARM and SOC platforms including video outputs such as LVDS. Looking down the road, the standard will also allow for the use of DisplayPort 24-bit RGB and HDMI. Another first are the dedicated camera interfaces, which are included in the standard, minimizing design efforts and BOM. As a result, users no longer need to compromise or work with inefficient standards that are stretched between the x86 feature set and lean ARM and SOC I/Os. Initially covered under the standard are two module footprints to offer flexibility for different mechanical requirements: a short module measuring 82 mm x 50 mm and a full size module measuring 82 mm x 80 mm. Other sections of the standard address the already familiar requirements of other module standards, resulting in the latest 1.0 version achieving a high-degree of maturity. More details are available under NDA.

"Our strategic entry and massive investment is spearheaded not only by upcoming product launches, but moreover by a new Computer-on-Modules form factor standard for these new products. This emphasizes our commitment to the standardization of scalable technologies right from the onset," Dirk Finstel, CTO of Kontron explained. "We have been very successful with embedded form factor standardization and particularly with ETX and COM Express standards. Now we have begun to mirror this success story in the ARM and SOC market segment, which complements that of x86 technology. Compared to the current ARM and SOC approach, which is characterized by full custom designs alone, customers benefit from the new massively reduced R&D investment costs, by utilizing application ready platform solutions, that have not been available in their sectors prior to this standard. And we are very happy to have ADLINK on board to support this standard. This will accelerate its success."

"We are proud to be the first company to support the new low-power embedded architecture platform," Henk van Bremen, Product Director for Embedded Computing at ADLINK Technology added. "It is an honor and very exciting to be able to enter the previously proprietary ARM market with a standardization initiative for COTS products. This is ideal for custom specific designs based on a proven and scalable module platform and will save customers significant time and cost. The proof of concept will be validated extremely quickly by OEM implementations. And those implementations are expected to arrive in sufficient volumes to create a defacto standard. This will be very beneficial to all technology followers due to availability and cost effectiveness being guaranteed from the start."

The first Kontron ARM-based module early field testing platforms will be available in Q1 2012. Official product launches are expected shortly after. For the latest news and updates on Kontron's strategic entry into ARM architecture, visit http://kontron.com/....

About ADLINK

ADLINK Technology provides a wide range of embedded computing products and services to the test & measurement, automation & process control, gaming, communications, medical, network security, and transportation industries. ADLINK products include PCI ExpressR-based data acquisition and I/O; vision and motion control; and AdvancedTCA, CompactPCI, and Computer-on-Modules (COMs) for industrial computing. With the acquisition of Ampro Computers, Inc., ADLINK also provides a wide range of Extreme Rugged and Rugged Single Board Computers, Computer-on-Modules and Systems under the brand name Ampro by ADLINK. ADLINK strives to minimize the total cost of ownership (TCO) of its customers by providing customization and system integration services, maintaining low manufacturing costs, and extending the lifecycle of its products. ADLINK is a global company with headquarters and manufacturing in Taiwan; R&D and integration in Taiwan, China, and the US; and an extensive network of worldwide sales and support offices.

ADLINK is ISO-9001, ISO-14001, ISO-13485 and TL9000 certified, is an Associate Member of the Intel® Embedded Alliance, an Executive Member of PICMG, a Sponsor Member of the PXI Systems Alliance, and a Member of the AXIe Consortium. ADLINK is a publicly traded company listed on the TAIEX Taiwan Stock Exchange (stock code: 6166).

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