iTAC Software AG: Ongoing innovation for electronics manufacturing at the SMT Hybrid Packaging
iTAC showcases new enterprise manufacturing intelligence functions at the SMT fair
(PresseBox) (Dernbach, )As always, the SMT Hybrid Packaging trade fair between May 8 and 10 will be a hive of activity for all aspects of microelectronic system integration. MES provider iTAC Software AG (http://www.itacsoftware.de) will be presenting tailor-made solutions for the electronics industry at booth 555 in hall 7, where the iTAC specialists will be on hand to discuss comprehensive SMT equipment integration and new services that focus on factory visualization and integrated reporting for electronic and mechatronic component production. There’s also a preview of the new iTAC.MES.Suite release 7.10 which is due to be launched in June.
The SMT Hybrid Packaging in Nuremberg is the trade show for SMT equipment, component and service providers from all over the world. iTAC Software AG is an exhibitor at the SMT Hybrid Packaging and the only MES provider to offer a standardized interface between its iTAC.MES.Suite and all leading SMT machines. A plug & play connection enables the scalable integration of different machine types and makes. This means that the MES solution and all its functions can be used in the highly automated production environments found in electronics manufacturing facilities.
iTAC’s booth 555 is located amongst the equipment manufacturers in hall 7. Visitors to the booth can discover the benefits of its standardized interface technology across the entire supply chain and get a demonstration of the new services and functions for the electronics manufacturing industry that are now integrated in its MES software. An additional focus is on cloud-based MES and other functional aspects of a modern enterprise manufacturing intelligence solution, from factory visualization to production-related reports and concepts for complete traceability across all plants and the entire supply chain.
All these new features will be available in release 7.10 of the proven iTAC.MES.Suite. It will be launched in June 2012 and is being showcased at the SMT Hybrid Packaging.