Small Size, Big Impact – COM R2.1 Specifications Introduce Small Form Factor

James Wang, Product Manager, Advantech - The COM Express standard has been the standard in the market for Computer on Modules since 2005.
(PresseBox) (Germering, ) A wide variety of applications are built on COM thanks to its many features which include different form factors, a 440 pin-out, an expansion interface, and I/O connectors enabled by advanced chipsets. As time evolves, the standard is adapting to new technologies and markets. In 2010, PICMG led numerous major changes in COM R2.0 specifications. And in 2012, COM R2.1 was released, bringing new innovation to a platform already known for its consistency and longevity.

New Mechanical Changes

COM R2.1 defines the standard for the small form factor, COMe-Mini, with a revised Type 10 pin-out definition. It offers high-speed interfaces such as LVDS, eDP, HDMI, DisplayPort, USB3.0, USB Client and CAN Bus for mobile devices, all on an 84 x 55mm card. COM R2.1 also supports a wide input voltage range from 4.75V to 20V, meeting the charging requirements of battery-operated mobile devices. As a result, more and more portable devices are being designed with embedded COM. The small size can fit in limited space, and lower power consumption means longer lasting operating time. There is also a promising future for COM in an increasing number of application areas, such as portable ultrasound machines, 3G testing equipment, mobile automotive repair systems, and mobile GPS devices.

Comparison of COM R2.0 and COM R2.1

COM R2.0
* USB3.0: Type 6
* eDP: N/A
* CAN Bus: N/A
Form Factor: Basic, Compact
Power Input: +12V fixed for all

COM R2.1

* USB3.0: Type 6 & 10
* eDP: Type 6 & 10
* CAN Bus: Type 6 & 10
Form Factor: Basic, Compact, Mini
Power Input: 4.75~20V for Mini Module

Medical Device Quality is Enhanced by COM’s Small Form Factor

One of Advantech’s application case studies in small form factor COM deployment is the SOM-7565 COMe-Mini, which is designed for ultrasound devices. Clinical professionals rely heavily on ultrasound devices for internal examination of patients. High quality, high-definition ultrasound imaging is much more accessible these days; the technology has advanced, costs have come down and hospitals have invested a lot of capital to purchase both high-end fixed and entry-level portable models. What they look for is not merely high-performance computing power but also a rugged form factor that meets stringent environmental conditions, such as temperature extremes, shock, and vibration. With passive cooling, easy customization and integration, COM provides a cost-effective solution with broad standards-based availability and longevity support.
Advantech SOM-7565 COM-mini is compliant with COM R2.0 and its core design includes SSD, wide-range voltage input, onboard memory and flash in a reliable card-sized board. The wide-range voltage input allows compatibility with a battery or charging device and reduces voltage loss.

Cross-Platform Remote Management

Ensuring proper sharing and recovery of critical medical data from ultrasound machines is still a challenge. In the past, it took time and resources to retrieve data from each machine and then move it to a central data center. These days, hospitals and medical practitioners demand a much more effective way to boost their work efficiency. Advantech’s SOM-7565 Computer on Module with Advantech SUSIAccess remote management software has been chosen for its winning combination of powerful, reliable features and complete remote control functions. SUSIAccess provides seamless image recovery, back-up capability, and remote management, which helps staff manage ultrasound devices so they can operate under any conditions, more efficiently, and at reduced cost.

Expertly Integrated Design-in Services

While customers capitalize on COM’s advantages—short time-to-market, focused core knowledge, and simplified development–now they can also embrace the new COM R2.1 specifications, which make mobile applications possible due to size and lower power consumption. For long-term success, it is important to find a reliable partner to ensure investments in capital really pay off.
Advantech COM Design-in Services covers all your questions from the design-in process and volume production, to product lifecycle management. Customers gain benefits from easy selection of a full spectrum of boards, modules, and software, all backed up by Advantech expert know-how and consistent product integration. Advantech applies a strict process to all COM design-in projects from planning a suitable solution, designing a carrier board, design validation, integration of thermal solutions, and production, to end-of-life services and support. Customers find Advantech to be a flexible and trusted partner offering worldwide delivery services at each stage of product development.


About Embedded Core Service

Advantech Embedded Core Services offers design-in oriented services. These streamlined solutions broadly integrate embedded boards, peripheral modules and software. This dedicated focus on Embedded Design-in services fulfills electronic engineering demands at their design-in phase, and brings benefits that shorten the design and integration cycles, minimizing uncertainty and risk.


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