New J-Series CO2 Lasers Enable Rapid Response for System Integrators
Coherent presents at the MACH 2014 Birmingham / UK
(PresseBox) (Santa Clara, Calif., )Coherent, Inc. (Santa Clara, CA) (Nasdaq: COHR) has introduced a new range of compact, sealed, CO2 lasers that simplify integration and minimize time-to-market for laser system builders. This is because all DIAMOND J Series lasers feature a common mechanical, electrical, optical, software and control interface, with the only difference between models being overall package length. This platform uniformity enables system integrators to focus more on process development rather than laser integration and tool re-engineering. Utilizing the J-Series platform, integrators can better capitalize on new opportunities presented in today's fast-paced world of applications and product development. Furthermore, the common J Series software interface reduces the need to train service personnel on new systems. Plus, advanced onboard diagnostics enable preventative maintenance, minimize downtime, and often eliminate the need for field service calls or laser returns.
J-Series lasers are based on Coherent's state-of-the-art, field proven, fully sealed, slab discharge technology, which delivers superior performance and exceptional reliability. For example, this construction combines high beam quality (M²<1.2), and high peak power, fast rise/fall time pulses to yield high processing efficiency and speed, while minimizing the heat affected zone. An integrated RF power supply in J-Series lasers eliminates the traditional RF umbilical to enhance reliability and lower cost of ownership, while reducing the overall laser footprint.
DIAMOND J Series lasers are available in powers ranging from 150W to greater than 400W, and output wavelengths of 10.6 µm and 9.4 µm. This makes them suitable for a wide range of tasks in cost and space-sensitive applications such as converting, marking, engraving, cutting, perforating and drilling. The long wave infrared output of these CO2 lasers makes them compatible with numerous organic materials, including paper, cardboard, plastic films, textiles, leather, wood, plastics, and carbon composites, as well as glass and even thin metals.