New Adhesives for Thermal Challenges in Microelectronics Assemby

Polytec TC 433 and TC 432
Polytec TC 433 (PresseBox) (Waldbronn, ) Thermally conductive mounting of power devices, e.g. LEDs, on respective heat sinks can be substantially enhanced by using Polytec’s TC 433 boron nitride filled adhesive featuring 2 W/mK thermal conductivity and a glass transition around 110 °C after thermal curing, and withstanding up to 220 °C continuous operation temperature. TC 432 is a modification curing at room temperature with a pot life of ca. 15 min, about 1.8 W/mK thermal conductivity and ca. 75 – 80 °C glass transition temperature.

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Polytec PT GmbH Polymere Technologien
Polytec-Platz 1-7
D-76337 Waldbronn
Andreas Bauer
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